For next-generation wafer inspection, the customer developed a
non-contact, non-destructive measurement for inline front-end
processes. The benefits range from stand-alone applications to
fully automated inline measurements where every single wafer
can be measured in production.
• The first prototype was delivered within the time budget after
the start of the project. This was a result of the fact that all
company competences were combined. This allowed for
great collaboration of the design, manufacturing and
• The box frame was optimised for stiffness to get a high as
possible system bandwidth to make sure that settling times
and accuracies were according to specification;
• The modular design allows for various configurations of the
system. The system can either be equipped with 5 or 7
motion axis. Also, if desired, a vibration isolation system
can be integrated.